For touch screen, there are several critical defects. I would like to share some critical defect reasons for Pcap and Resistive Touchscreen.

Firstly, I would like to share Pcap defects.

As we all know, there are 5 elements that are critical for the quality, Man, Method, Machine, Material and Environment.

There are several common defects for Pcap,

1, FPC.

2, IC,

3, Printing.

Among the defects of Pcap, FPC bonding failure is the most common one.

Look at the pic1. this failure is critical for the quality.

There are some steps to follow to avoid such defect.

1. Use the right ACF for bonding.

2. Make sure the flatness of the indenter.

3. The pressure is right when bonding(each FPC requires different pressure).

4. The right temperature for Bonding.

5. Checking after bonding.

Use microscope to check the bonding position(refer to pic3), if the particle of ACF broken uniformly, it will be good(refer to pic4).

Chamber testing. Implement 240 hours chamber testing. After testing, check the function of Pcap and peeling off strength of the FPC. Look at Pic 4, if the function is okey, and the uniformity of particle is good, then, the Boning procedure will be good.